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Thermoelectric Cooling Plate, semiconductor Cooler, Heat Sink, t

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Thermoelectric Cooling Plate, semiconductor Cooler, Heat Sink, t

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Product description

Specification:
Item Type: Thermoelectric Cold Plate
Model: TEC1-26306
Material: ceramic
Rated voltage: DC24V
Maximum voltage: DC30V (Th = 30 )
Maximum current: 6A (U = 30 V, Th = 30 )
Maximum temperature difference: 66 (Qc = 0, Th = 30 )
Maximum cooling power: 107 W ( T = 0 , Th = 30 )
Internal resistance: 3.7-4.3 Ω
Lead specification: 20 AWG, L = 150mm
Packing process: 704 silicone rubber gasket
Assembly pressure: 6 kg
Working temperature: -50 ~ + 80
Storage temperature: -40 ~ + 60
Scope of application:
1. Applications in high-tech areas: satellites, semiconductor lasers, infrared thermal imaging cameras, infrared detectors, optoelectronic devices, etc.
2. Household Appliances Applications: Dehumidifiers, portable heating and cooling boxes, hot and cold water dispensers, cooling helmets, cold beverage mugs, beverage wine coolers, etc.
3. Application in electronic technology: cooling electronic devices, electronic components, computers, etc.
4. Industrial applications: car refrigerators, small air conditioners, dehumidifiers, thermostats, petroleum testers, etc.
5. Agricultural and biological applications: physical cooling pads, physiological semiconductor wafers, vaccine preservation, etc.


Package List:
1 x semiconductor cooling film

Thermoelectric Cooling Plate, semiconductor Cooler, Heat Sink, t

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